Sameer Sonkusale

Education

B.E., Birla Institute of Technology and Science

M.S.E., University of Pennsylvania

Ph.D., University of Pennsylvania
 

Honors and Awards

Associate Editor, IEEE Transactions on Circuits and Systems

NSF CAREER Award, 2010

Best Poster, Future Trends in Microelectronics, 2009

Best Student Device Poster (Paper) Award, International Semiconductor Device Research Symposium, 2009

Best Poster (Paper) Award, 8th International Conference in Noanotechnology, 2008
 

Research

Integrated Circuits for Sensors and Instrumentation

Nanoelectrochemical Systems on Silicon

CMOS Image Sensors for Scientific Imaging

Analog to Information Converters

Active Metamaterial Circuits and Systems

Terahertz Integrated Circuits

Metamaterials and Plasmonics

 

Classes Taught

Advanced Analog Electronics

Electronics II

Analog and Mixed Signal MOS IC Design

Introduction to VLSI Design
 

Selected Publications

Liu, X., MacNaughton, S., Shrekenhamer, D. B., Tao, H., Selvarasah, S., Totachawattana, A., . . . Padilla, W. J. (2010). Metamaterials on parylene thin film substrates: Design, fabrication, and characterization at terahertz frequency. Applied Physics Letters, 96(1)

Luo, Z., & Sonkusale, S. (2008). A novel BPSK demodulator for biological implants. IEEE Transactions on Circuits and Systems I: Regular Papers, 55(6), 1478-1484.

Shrekenhamer, D., Rout, S., Strikwerda, A. C., Bingham, C., Averitt, R. D., Sonkusale, S., & Padilla, W. J. (2011). High speed terahertz modulation from metamaterials with embedded high electron mobility transistors. Optics Express, 19(10), 9968-9975.

Trakimas, M., & Sonkusale, S. R. (2011). An adaptive resolution asynchronous ADC architecture for data compression in energy constrained sensing applications. IEEE Transactions on Circuits and Systems I: Regular Papers,58(5), 921-934.

Xu, W., Luo, Z., & Sonkusale, S. (2009). Fully digital BPSK demodulator and multilevel LSK back telemetry for biomedical implant transceivers. IEEE Transactions on Circuits and Systems II: Express Briefs, 56(9), 714-718.